Course Description
As the number and variety of thin films employed in the manufacture of advanced silicon ICs continues to grow dramatically, CVD plays an ever-expanding role. This full-day on-site course examines the several types of CVD processes and each of the huge assortment of films deposited by CVD in conventional silicon wafer fab processes. Topics covered include
- CVD basics – e.g., heterogeneous vs. homogeneous reactions, mass-transport-limited vs. surface reaction rate-limited processes
- generic CVD process mechanisms
- types of CVD processes – e.g., APCVD, LPCVD, PECVD
- CVD films – epitaxial silicon, polycrystalline silicon, silicon nitride, silicon oxynitrides, silicon oxide, tungsten, refractory metal silicides and nitrides, low-k dielectrics, high-k dielectrics
- trade-offs of different processes and different chemistries
- achieving optimal step coverage
- CVD equipment architecture
- ALD (atomic layer deposition)
Who Should Attend
This course is designed for semiconductor industry professionals who wish to enhance or update their knowledge of CVD. These include
- process engineers and technicians
- equipment engineers and technicians
- process integration engineers
- yield engineers
- production supervisors
- technical managers
- equipment/materials sales/marketing experts
Course Notes
A comprehensive, detailed course manual is provided.
Course Fee and Additional Information
To schedule this course at your site or for additional information, including course fees, please contact the course instructor.